Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955454 | Wafer bonding apparatus and method | Mengyong Liu, Yang Liu, Wu Liu | 2024-04-09 |
| 11923466 | Photodetector with integrated reflective grating structure | Chih-Kuo Tseng, Xiaoyao Li, Yuzhou SUN, Yue Xiao | 2024-03-05 |