Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146078 | Adhesive resin composition and laminate | Hirokazu Iizuka, Jun Suzuki | 2024-11-19 |
| 12116509 | Hot-melt adhesive resin composition and hot-melt adhesive resin laminate | Hirokazu Iizuka | 2024-10-15 |
| D1021866 | Earphone | — | 2024-04-09 |
| 11939492 | Adhesive resin composition, method for bonding adherends, and adhesive resin film | Hirokazu Iizuka, Yuiko Maruyama, Yuki Sato | 2024-03-26 |
| 11904577 | Hot-melt adhesive resin film and production method thereof | Yuiko Maruyama, Hirokazu Iizuka | 2024-02-20 |