Akira Yamauchi

BC Bondtech Co.: 1 patents #1 of 1Top 100%

📍 Kyoto, MI: #11 of 13 inventorsTop 85%

Overall (2024): #553,618 of 561,600Top 100%

Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
12094747	Substrate bonding device	—	2024-09-17