Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040241 | Package structure for semiconductor device and preparation method thereof | Chen Liu, Hongliang Lv | 2024-07-16 |
| 11948983 | Method for preparating SiC ohmic contact with low specific contact resistivity | Yanfei Hu, Hui Guo, Jiabo Liang, Yanjing He, Hao Yuan +1 more | 2024-04-02 |
| 11941553 | Methods, electronic devices and storage media for ship route optimization | Jingyu Yu, Jingfeng Wang, Wei-Syun LIN, Yuxue Pu, Yongchao Zhu +4 more | 2024-03-26 |