Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150243 | Package assembly | Yi Cheng, Wei-Ching Chang, Kang-Bin Mah, Li-Wei Chen, Zi-Ping Wu | 2024-11-19 |
| 12089369 | Separate immersion cooling device and separate immersion cooling system having the same | Yi Cheng, Tsung-Han Li, Chin-Han Chan | 2024-09-10 |
| 12075599 | Electronic apparatus, immersion cooling system and liquid amount adjusting module | Chun-Wei Lin, Pai-Chieh Huang, Chin-Han Chan, Hsien-Chieh Hsieh | 2024-08-27 |