Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876003 | Semiconductor package and packaging process for side-wall plating with a conductive film | Longnan Jin, Junfeng Liu, Huiying Ding, Thomas Schmidt | 2024-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876003 | Semiconductor package and packaging process for side-wall plating with a conductive film | Longnan Jin, Junfeng Liu, Huiying Ding, Thomas Schmidt | 2024-01-16 |