Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091581 | High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2024-09-17 |