Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884859 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Agnes Derecskei | 2024-01-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884859 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Agnes Derecskei | 2024-01-30 |