Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12173201 | Copper-clad laminate and method of forming the same | Jennifer Adamchuk, Meghann White, Sethumadhavan Ravichandran, Gerard T. Buss | 2024-12-24 |
| 12049577 | Dielectric substrate and method of forming the same | Jennifer Adamchuk, Meghann White, Sethumadhavan Ravichandran, Gerard T. Buss | 2024-07-30 |