Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131973 | Semiconductor device and method forming the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Chang-Sheng Lin | 2024-10-29 |
| 11935878 | Package structure and method for manufacturing the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Chang-Sheng Lin | 2024-03-19 |