Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12099078 | Probe card and wafer testing assembly thereof | Yi-Chien Tsai, Huo-Kang Hsu, Yu-Wen Chou | 2024-09-24 |
| 11999661 | Interface joint material based on industrial solid waste and its preparation | Chonggen Pan, Jiawei Zang, Shiyang Qu, Zhigao Wei | 2024-06-04 |
| 11981604 | Concrete crack repair material based on nano materials and its preparation method | Chonggen Pan, Shiyang Qu, Jiawei Zang | 2024-05-14 |