Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12108544 | Multi-layer printed circuit board made of different materials and manufacturing method thereof | Eun Ha Park, Young Jun Kim, Yu Jin Choi, Kum Sun PARK, Chung Hyeon KIM | 2024-10-01 |