Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057409 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh +1 more | 2024-08-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057409 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh +1 more | 2024-08-06 |