Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027452 | Interconnection substrate, semiconductor package, and method of manufacturing interconnection substrate | — | 2024-07-02 |
MS
Motoshi SETO
Overall (2024): #333,957 of 561,600Top 60%
1
Patents 2024