Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119308 | Packaging structure of semiconductor chip and formation method thereof | Honghui Wang | 2024-10-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119308 | Packaging structure of semiconductor chip and formation method thereof | Honghui Wang | 2024-10-15 |