DS

Dai Shiota

TC Tokyo Ohka Kogyo Co.: 3 patents #2 of 54Top 4%
TF Tokyo University Of Science Foundation: 1 patents #6 of 40Top 15%
Overall (2024): #89,292 of 561,600Top 20%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12099297 Energy-sensitive composition, cured product, and forming method of patterned cured product Kunihiro Noda, Koji Arimitsu 2024-09-24
11912889 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer Kunihiro Noda, Takehiro Seshimo 2024-02-27
11905433 Energy-sensitive composition, cured product, and forming method of cured product Kunihiro Noda, Hiroki Chisaka, Kazuya Someya 2024-02-20