Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106995 | Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole | Shao-Ying Ting, Chia-En Lee, Chen-ke HSU | 2024-10-01 |
| 12080688 | Light-emitting diode packaging module | Zhen-Duan Lin, Yanqiu LIAO, Shuning Xin, Weng-Tack WONG, Junpeng SHI +5 more | 2024-09-03 |
| 11878231 | Wearable device and method for controlling wearable device | Yu Tang, Xuan Rao, Cheng Long, Tianming Song | 2024-01-23 |