Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11858661 | Method of manufacturing an assembly having a nominal thickness skin panel | Benjamin S. Merrit, Hsien-Lin Huang, Mark Abdouch, Nathan Alphonse Secinaro | 2024-01-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11858661 | Method of manufacturing an assembly having a nominal thickness skin panel | Benjamin S. Merrit, Hsien-Lin Huang, Mark Abdouch, Nathan Alphonse Secinaro | 2024-01-02 |