Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125811 | Semiconductor structure and method for wafer scale chip package | Indumini Ranmuthu, Manoj Kumar Jain | 2024-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125811 | Semiconductor structure and method for wafer scale chip package | Indumini Ranmuthu, Manoj Kumar Jain | 2024-10-22 |