Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170256 | Contact pad fabrication process for a semiconductor product | Yung Shan Chang | 2024-12-17 |
| 12159846 | Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch | Richard Allen Faust, Robert M. Higgins, Anagha Kulkarni, Jonathan Philip Davis, Andrew Frank Burnett | 2024-12-03 |
| 12105161 | Layouts for interlevel crack prevention in fluxgate technology manufacturing | Sopa Chevacharoenkul | 2024-10-01 |
| 11887888 | Multi-pass plating process with intermediate rinse and dry | Peter John Holverson | 2024-01-30 |