Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142550 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Peter Anthony Fundaro | 2024-11-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142550 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Peter Anthony Fundaro | 2024-11-12 |