Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923258 | Semiconductor device package with die cavity substrate | William R. Morrison | 2024-03-05 |
| 11894313 | Substrate processing and packaging | Jane Qian Liu | 2024-02-06 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923258 | Semiconductor device package with die cavity substrate | William R. Morrison | 2024-03-05 |
| 11894313 | Substrate processing and packaging | Jane Qian Liu | 2024-02-06 |