Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021011 | Solder surface features for integrated circuit packages | Amirul Afiq Bin Hud, Wei Fen Sueann Lim | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021011 | Solder surface features for integrated circuit packages | Amirul Afiq Bin Hud, Wei Fen Sueann Lim | 2024-06-25 |