Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908735 | Vias for cobalt-based interconnects and methods of fabrication thereof | Min-Yann Hsieh, Hua Feng Chen, Kuo-Hua Pan | 2024-02-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908735 | Vias for cobalt-based interconnects and methods of fabrication thereof | Min-Yann Hsieh, Hua Feng Chen, Kuo-Hua Pan | 2024-02-20 |