Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12016165 | Shield package | Hiroaki Umeda, Hidetoshi Noguchi, Sougo ISHIOKA | 2024-06-18 |
| 11912897 | Electroconductive coating material and method for producing shielded package using said electroconductive coating material | Kazuhiro Matsuda | 2024-02-27 |