Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087724 | Palladium-coated copper bonding wire and method for manufacturing same | Hiroyuki Amano, Takeshi Kuwahara | 2024-09-10 |
| 11876066 | Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device | Hiroyuki Amano, Takeshi Kuwahara, Tsukasa ICHIKAWA | 2024-01-16 |