Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068115 | Ceramic electronic component, circuit substrate arrangement, and method of manufacturing ceramic electronic component | Anju Okada, Takahisa Fukuda | 2024-08-20 |
| 11915879 | Electronic component, circuit board arrangement and method of manufacturing electronic component | Anju Okada, Kiyoshiro Yatagawa, Takahisa Fukuda | 2024-02-27 |