Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107004 | In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion | Hsun-Chung Kuang | 2024-10-01 |
ZG
Zhen Yu Guan
Overall (2024): #196,343 of 561,600Top 35%
1
Patents 2024