Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183628 | Integrated circuit and method for manufacturing the same | Kuan-Wei Huang, Yu-Yu Chen, Jyu-Horng Shieh | 2024-12-31 |
| 12170205 | Methods for fabricating semiconductor structures | — | 2024-12-17 |
| 12165914 | Air spacer surrounding conductive features and method forming same | Yu-Yu Chen, Kuan-Wei Huang, Li-Min Chen | 2024-12-10 |
| 12153350 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Huicheng Chang, Chia-Cheng Chen, Jyu-Horng Shieh, Liang-Yin Chen +7 more | 2024-11-26 |
| 12142520 | Middle-of-line interconnect structure having air gap and method of fabrication thereof | Jyu-Horng Shieh | 2024-11-12 |
| 12014952 | Lithography method to reduce spacing between interconnect wires in interconnect structure | Yu-Yu Chen | 2024-06-18 |