Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183633 | Dielectric cap structure in semiconductor devices and methods of manufacturing the same | Yi-Chen Wang, Guang-Hong Cheng, Wen-Yun Wang, Yuan-Tien Tu, Huan-Just Lin | 2024-12-31 |
| 12119386 | Conductive capping for work function layer and method forming same | Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu | 2024-10-15 |
| 12107007 | Recessed contacts at line end and methods forming same | Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu | 2024-10-01 |
| 12107003 | Etch profile control of gate contact opening | Yi-Chun Chang, Jyun-De Wu, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin | 2024-10-01 |
| 12087832 | Semiconductor device interconnects and methods of formation | I-Hung LI, Yi-Ruei Jhan, Yuan-Tien Tu | 2024-09-10 |
| 12080597 | Semiconductor devices and methods of manufacture | Jyun-De Wu, Peng Wang, Huan-Just Lin | 2024-09-03 |
| 12057345 | Etch profile control of gate contact opening | Jyun-De Wu, Peng Wang, Huan-Just Lin | 2024-08-06 |
| 11996321 | Semiconductor structure and method for forming the same | Jyun-De Wu, Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu | 2024-05-28 |
| 11967622 | Inter block for recessed contacts and methods forming same | Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu | 2024-04-23 |
| 11967526 | Integrated circuit structure and manufacturing method thereof | Peng Wang, Jyun-De Wu, Huan-Just Lin | 2024-04-23 |
| 11961893 | Contacts for semiconductor devices and methods of forming the same | Jyun-De Wu, Yi-Chen Wang, Yi-Chun Chang, Yuan-Tien Tu | 2024-04-16 |
| 11942371 | Etch profile control of via opening | Jyun-De Wu, Peng Wang, Huan-Just Lin | 2024-03-26 |