Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020906 | Grounding cap module and gas injection device | Li-Shi Liu | 2024-06-25 |
| 11875973 | Methods for preparing void-free coatings for plasma treatment components | Tsung-Cheng Ho, Chien-Yu Wang, Yen-Shih Wang, Jiun-Rong Pai, Yeh-Chieh Wang | 2024-01-16 |