MY

Ming-Hsien Yang

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #336,212 of 561,600Top 60%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12148782 Composite BSI structure and method of manufacturing the same Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze +3 more 2024-11-19