ML

Min-Hui Lin

QU Qualcomm: 1 patents #1,016 of 2,255Top 50%
📍 Guoxing Township, TW: #6 of 12 inventorsTop 50%
Overall (2024): #340,886 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11977979 Adaptive bounding for three-dimensional morphable models Kuang-Man Huang, Ke Cheng, Michel Adib Sarkis 2024-05-07