MJ

Min-Chie Jeng

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Taipei, CA: #104 of 209 inventorsTop 50%
Overall (2024): #342,230 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11978712 Method of forming semiconductor package transmission lines with micro-bump lines Chin-Wei Kuo, Hsiao-Tsung Yen, Yu-Ling Lin 2024-05-07