Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068395 | Method for forming an undoped region under a source/drain | Ji-Yin Tsai, Jeng-Wei Yu, Yi-Fang Pai, Pei-Ren Jeng, Yee-Chia Yeo +1 more | 2024-08-20 |
| 11978641 | Wafer bonding method and semiconductor structure obtained by the same | Pei-Yu Chou, Yen-Yu Chen, Shiang-Bau Wang, Tze-Liang Lee | 2024-05-07 |