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Li-Wei Yin

TSMC: 3 patents #1,177 of 4,162Top 30%
Overall (2024): #76,602 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12132050 Semiconductor structure cutting process and structures formed thereby Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang +2 more 2024-10-29
12027608 Semiconductor structure having dielectric structure extending into second cavity of semiconductor Fin Ryan Chia-Jen Chen, Tzu-Wen Pan, Cheng-Chung Chang, Shao-Hua Hsu, Yi-Chun Chen +2 more 2024-07-02
11894370 Semiconductor structure cutting process and structures formed thereby Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang +2 more 2024-02-06