Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136600 | Grounded metal ring structure for through-silicon via | Shih-Chang Chen, Cheng-Chien Li | 2024-11-05 |
KL
Kun-Hsiang Lin
Overall (2024): #378,395 of 561,600Top 70%
1
Patents 2024