Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154608 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin +4 more | 2024-11-26 |
| 12087692 | Hardened interlayer dielectric layer | Greg Huang | 2024-09-10 |
| 12080547 | Interconnect system with improved low-K dielectrics | Yu Lun Ke, Yi-Wei Chiu | 2024-09-03 |
| 11990167 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin +4 more | 2024-05-21 |
| 11961803 | Semiconductor structure having high breakdown voltage etch-stop layer | Chin Kun Lan | 2024-04-16 |