Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142542 | Semiconductor device having a thermal contact and method of making | Feng Han, Shuai Zhang | 2024-11-12 |
| 12094799 | Method of making a semiconductor device having a thermal contact | Feng Han, Shuai Zhang | 2024-09-17 |
| 12040358 | Method of manufacturing a super junction structure and super junction structure | Shuai Zhang, Feng Han, Lian-Jie LI, Zhong-Hao CHEN | 2024-07-16 |
| 11973083 | Method of making semiconductor device having buried bias pad | Feng Han, Shuai Zhang | 2024-04-30 |
| 11862527 | Thermal substrate contact | Feng Han, Shuai Zhang | 2024-01-02 |