JL

Jia-Hong Liao

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #415,681 of 561,600Top 75%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12125727 Wafer transfer system and a method for transporting wafers Ren-Hau Wu, Cheng-Kang Hu, Chieh-Chun Lin, Cheng-Yi Liu 2024-10-22