HL

Hsien-Chin Lin

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #440,324 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11948842 Etch stop layer between substrate and isolation structure Ming-Chang Wen, Chang-Yun Chang, Hung-Kai Chen 2024-04-02