Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148692 | Semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2024-11-19 |
| 11973038 | Package structure with improved antenna patterns performance | Kai-Chiang Wu | 2024-04-30 |