DY

De-Wei Yu

TSMC: 2 patents #1,566 of 4,162Top 40%
📍 Lileng, TW: #2 of 3 inventorsTop 70%
Overall (2024): #171,778 of 561,600Top 35%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12183590 Method of performing gap filling including filling trenches between dummy gate stacks on semiconductor fins/strips with semiconductor material Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang 2024-12-31
11901442 Method of manufacturing a semiconductor device and a semiconductor device Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau +3 more 2024-02-13