Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057353 | Measurement pattern and method for measuring overlay shift of bonded wafers | Ming-Sung Kuo, Hsun-Kuo Hsiao, Po-Wei Chen | 2024-08-06 |
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Chung-Cheng Chen
Overall (2024): #515,282 of 561,600Top 95%
1
Patents 2024