Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087662 | Semiconductor package structure having thermal management structure | — | 2024-09-10 |
| 12068227 | Structures and methods for reducing process charging damages | Kuan-Jung Chen, Cheng-Hung Wang, Tsung-Lin Lee, Shiuan-Jeng Lin, Wen-Chih Chiang | 2024-08-20 |
| 11972973 | Semiconductor structure and method of manufacturing a semiconductor structure | — | 2024-04-30 |