Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894284 | Semiconductor structure having silver-indium transient liquid phase bonding joint | Yongjun Huo | 2024-02-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894284 | Semiconductor structure having silver-indium transient liquid phase bonding joint | Yongjun Huo | 2024-02-06 |