Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176424 | FinFET device comprising plurality of dummy protruding features | Po-Chi Wu, Chih-Han Lin, Horng-Huei Tseng | 2024-12-24 |
| 12166040 | Integrated circuit and manufacturing method thereof | Chih-Han Lin, Horng-Huei Tseng | 2024-12-10 |
| 12125751 | Method and structure for FinFET isolation | Chih-Han Lin, Jr-Jung Lin | 2024-10-22 |
| 12080770 | Semiconductor device and method | Chih-Han Lin, Horng-Huei Tseng | 2024-09-03 |
| 12057343 | FinFET devices with embedded air gaps and the fabrication thereof | Chih-Han Lin | 2024-08-06 |
| 12051752 | Embedded source or drain region of transistor with downward tapered region under facet region | Tung-Wen Cheng, Zhe Zhang, Yung-Jung Chang | 2024-07-30 |
| 12033891 | Method of forming trenches | Chih-Han Lin | 2024-07-09 |
| 11973144 | Method of manufacturing a semiconductor and a semiconductor device | Chang-Yin Chen, Chih-Han Lin | 2024-04-30 |
| 11948835 | Interconnection structure with anti-adhesion layer | Chih-Han Lin | 2024-04-02 |
| 11935889 | Fin structure and method of forming same through two-step etching processes | Chih-Han Lin, Horng-Huei Tseng | 2024-03-19 |
| 11929419 | Semiconductor device | Chang-Yin Chen, Chih-Han Lin | 2024-03-12 |