BC

Bo-Sen Chang

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #526,460 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12183729 Integrated circuit filler and method thereof Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li +1 more 2024-12-31