Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11865755 | Large part injection mold apparatus and process | William Henderson, Ling Feng | 2024-01-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11865755 | Large part injection mold apparatus and process | William Henderson, Ling Feng | 2024-01-09 |