Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864317 | Sn—Bi and copper powder conductive paste in through hole of insulating substrate | Masaaki Katsumata, Koji Taguchi, Norifumi SASAOKA | 2024-01-02 |
YN
Yosuke Noda
Overall (2024): #205,880 of 561,600Top 40%
1
Patents 2024